This offer is for a set of thermal pastes for use on laptops, desktops, gamestations, Apple, iMac, PS3, PS4, XBOX etc. The packet includes 20g (2 X 10g) of K5-PRO gummy thermal paste which is designed to replace thermal pads and 7g of K4-PRO thermal for use on the CPU (variations may apply depending on the video board you are using).

K5-PRO viscous thermal paste & K4-PRO low viscosity thermal paste are developed and produced by Computer Systems laboratories research department. These products were developed as part of C.S. Labs BGA rework research project with the support of Greece and Europian Union. These product are designed to reduce the chances of BGA component failure for reasons related to overheating

    Key features of K5-PRO:

• K5-PRO is a high quality gummy thermal paste designed for use on memory chips and GPUs of various computers including PS3 CECHAxx, Apple iMac A1235 video boards. This is the only commercially available product at the moment that can replace the gummy thermal paste that is originally used by Apple.
• K5-PRO can replace soft thermal pads that are used on computers (up to 3mm thick).
• K5-PRO has thermal conductivity K>5,3 W/m.K * (at least 3 times higher than common thermal pads that are used on computers and commercial electronics).
• K5-PRO is applied very easily directly on the component and has no electrical conductivity. It can be heated up to 250 degrees (Celsius) and has a long operational life time (pracically infinite after the installation).
• This new packaging offers easier and faster application since you will be able to apply K5-PRO, on memory chips and the GPUs, directly withought using a spreader scraper.

    Key features of K4-PRO:

• K4-PRO is a high quality thermal paste designed for use on computer BGA components (GPU, CPU, etc).
• K4-PRO is a very low viscosity thermal paste (especially when heated during the fist use). It will cover all the invisible gaps between the component and the heatsink without creating a film of paste like most low cost thermal pastes.
• K4-PRO has thermal conductivity K>4,6 W/m.K * (3 times higher than common thermal pastes that are used on computers and commercial electronics)
• K4-PRO is applied very easily directly on the component and has no electrical conductivity. It can be heated up to 220 degrees (Celsius) and has a long operational life time (practically infinite)
• K4-PRO is produced in EU (Thessaloniki, Greece) and can be shipped to your location worldwide very fast. We use a 4th day delivery service worldwide.

    Set Contains:
2 X 10g K5-PRO high quality / high thermal conductivity gummy thermal paste
1 X 7g K4-PRO low viscosity / high thermal conductivity thermal paste in a syringe

    Expiration date:
No expiration date (new formula). Infinite storage / service life. Protect from frost and dust

    You can see our application instructions videos here:
https://www.youtube.com/watch?v=z6pf5freLBU
https://www.youtube.com/watch?v=JgrEyd93yHI

    When you should replace the thermal paste / pads in your computer:

Thermal paste and thermal pads should be replaced every time that the heat sink is removed (for cleaning, upgrade or other maintenance). Replacing the thermal pads and the gummy thermal paste that is used by Apple on the memory chips is very important if the heat sink is removed because if you reuse the same thermal pads or paste the heat sink is impossible to fit perfectly again and the component will be overheated and will fail soon.
If your computer is overheated or turns off after a few hours of use. In this case the entire heatsink system must be cleaned immediately and all thermal paste and thermal pads must be replaced.

Price includes VAT 24%. If you are VAT registered in EU please contact us before purchasing and we will offer a quote without VAT. Greek business customers should provide their business info in order to issue a commercial invoice.K5-PRO is produced in EU (Greece) and will be shipped directly from our production center in Thessaloniki Greece.

* Computer Systems matterials science laboratory testing : Method using a comparative technique (P. Karydopoulos, P. Frantzis, N. Karagiannis MSAIJ 2014)
https://www.youtube.com/watch?v=3BP7KMuF_ZI
https://www.researchgate.net/profile/Panagiotis_Frantzis2/publication